New work item proposal, NP
New work item proposal (NP) är termen som används inom IEC för nya förslag på standardiseringsprojekt.
Är du intresserad av att delta eller få ytterligare information om nya standardiseringsförslag, kontakta SEK kansli på senc@elstandard.se eller telefon 08-444 14 00.
Förslagen kan beställas kostnadsfritt från SEK Svensk Elstandard via formuläret nedan. Antalet kostnadsfria standardiseringsförslag är begränsat till tre. Vid beställning av fler än tre förslag tas en avgift på 300 kr/förslag.
| Benämning IEC | Benämning CLC | Titel | SEK grupp | Deadline |
|---|---|---|---|---|
| 2/2273/NP | PNW 2-2273 ED1: Part 27-7: Sealed winding test for insulation systems used in rotating electrical machines | TC 2 | 2026-01-01 | |
| 18A/510/NP | PNW 18A-510 ED1: Electrical installations in ships - Part xxx: Ship-to-shore connection cables of rated voltages up to and including 18/30 kV | TC 18/SC 18A | 2026-01-01 | |
| 47E/872/NP | PNW 47E-872 ED1: Semiconductor Devices - Part 16-XX: Microwave integrated circuits - Phase frequency detectors | TC 47/SC 47E | 2026-01-01 | |
| 91/2075/NP | PNW 91-2075 ED1: Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad | TC 91 | 2026-01-08 | |
| 91/2074/NP | PNW 91-2074 ED1: Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad | TC 91 | 2026-01-08 | |
| 91/2073/NP | PNW 91-2073 ED1: Thermography test method for printed circuit interconnection defects | TC 91 | 2026-01-08 | |
| 47/2969/NP | PNW 47-2969 ED1: Semiconductor devices - Neuromorphic devices - Part 5: Evaluation method of endurance and retention in memristor devices | TC 47 | 2026-01-08 | |
| 47/2968/NP | PNW 47-2968 ED1: Semiconductor devices-Neuromorphic devices - Part 6：Evaluation method of basic characteristics in one transistor one memristor (1T1M) arrays | TC 47 | 2026-01-08 | |
| 65C/1374/NP | PNW 65C-1374 ED1: Industrial networks – Profiles – Part 5-23: Installation of fieldbuses – Installation profiles for CPF 23 | TC 65/SC 65C | 2026-01-08 | |
| 65C/1373/NP | PNW 65C-1373 ED1: Industrial networks – Profiles – Part 2-23: Additional real-time fieldbus profiles based on ISO/IEC/IEEE 8802-3 - CPF 23 | TC 65/SC 65C | 2026-01-08 | |
| 65C/1372/NP | PNW 65C-1372 ED1: Industrial networks – Fieldbus specifications – Part 6-29: Application layer protocol specification – Type 29 elements | TC 65/SC 65C | 2026-01-08 | |
| 65C/1371/NP | PNW 65C-1371 ED1: Industrial networks – Fieldbus specifications – Part 5-29: Application layer service definition – Type 29 elements | TC 65/SC 65C | 2026-01-08 | |
| 65C/1370/NP | PNW 65C-1370 ED1: Industrial networks – Fieldbus specifications – Part 4-29: Data-link layer protocol specification – Type 29 elements | TC 65/SC 65C | 2026-01-08 | |
| 65C/1369/NP | PNW 65C-1369 ED1: Industrial networks – Fieldbus specifications - Part 3-29: Data-link layer service definition – Type 29 elements | TC 65/SC 65C | 2026-01-08 | |
| 47/2970/NP | PNW 47-2970 ED1: Semiconductor devices - Chip-scale testing for autonomous vehicles -Part 3: Thermal imagers | TC 47 | 2026-01-15 | |
| 62/571/NP | PNW 62-571 ED1: Medical devices – In silico technologies – Part 2: Credibility assessment of first-principles based methods | TC 62 | 2026-01-15 | |
| 62/568/NP | PNW 62-568 ED1: Management systems - Guidelines for incorporating ecodesign in the medical device sector | TC 62 | 2026-01-15 | |
| JTC1-SC43/183/NP | PNW TS JTC1-SC43-183 ED1: Information technology - Brain-computer Interfaces - Testing and post market surveillance protocols for non-medical BCIs | ISO/IEC JTC 1/SC 43 | 2026-01-22 | |
| 8C/153/NP | PNW TS 8C-153 ED1: Business Use Cases (BUCs) of Flexibility Services | TC 8/SC 8C | 2026-01-22 | |
| 91/2077/NP | PNW 91-2077 ED1: Circuit Board 2D Barcode Marking Requirements | TC 91 | 2026-01-22 | |
| 47/2973/NP | PNW 47-2973 ED1: Semiconductor devices - Chip-scale testing for autonomous vehicles - Part 2: Optical performance of LiDAR | TC 47 | 2026-01-22 | |
| 13/1981/NP | PNW 13-1981 ED1: Metrological requirements for in-situ control of EVSE | TC 13 | 2026-01-22 | |
| 13/1980/NP | PNW 13-1980 ED1: Requirements for enabling data exchange between Smart Meter and EVSE | TC 13 | 2026-01-22 | |
| 13/1979/NP | PNW 13-1979 ED1: Requirements for data integrity of EVSE measuring systems | TC 13 | 2026-01-22 | |
| 33/736/NP | PNW 33-736 ED1: DC filter capacitors for HVDC transmission system | TC 33 | 2026-01-22 |
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