New work item proposal (NP) är termen som används inom IEC för nya förslag på standardiseringsprojekt.
Är du intresserad av att delta eller få ytterligare information om nya standardiseringsförslag, kontakta SEK kansli på senc@elstandard.se eller telefon 08-444 14 00.
Förslagen kan beställas kostnadsfritt från SEK Svensk Elstandard via formuläret nedan. Antalet kostnadsfria standardiseringsförslag är begränsat till tre. Vid beställning av fler än tre förslag och för utskick av pappersexemplar tas en avgift på 300 kr/förslag.
| Benämning IEC | Benämning CLC | Titel | SEK grupp | Deadline |
|---|---|---|---|---|
| 46/1067/NP | PNW 46-1067 ED1: Leaky waveguide - Part 3: Sectional specification for rigid rectangular leaky waveguides | TC 46 | 2025-12-11 | |
| 114/602/NP | PNW TS 114-602 ED1: Marine energy - Wave, tidal and other water current converters - Part 11: Handbook for Scour Protection Methods | TC 114 | 2025-12-11 | |
| 125/122/NP | PNW 125-122 ED1: E-Transporters – Part 4-2: Electromagnetic compatibility (EMC) requirements and test methods for e-Transporters – Immunity | TC 125 | 2025-12-11 | |
| 65/1154/NP | PNW 65-1154 ED1: Internet of Things – Part 3: IoT applications for natural gas distribution systems | TC 65 | 2025-12-11 | |
| 91/2068/NP | PNW 91-2068 ED1: Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer | TC 91 | 2025-12-11 | |
| 87/921/NP | PNW 87-921 ED1: Underwater acoustics ̶ Calibration of interferometric fiber-optic hydrophones in the frequency range 10 Hz to 20 kHz | TC 87 | 2025-12-18 | |
| JTC1-SC43/179/NP | PNW JTC1-SC43-179 ED1: Information technology – Brain-computer Interfaces - Hardware interfaces and protocols | ISO/IEC JTC 1/SC 43 | 2025-12-18 | |
| 129/56/NP | PNW 129-56 ED1: Robotics for electricity generation, transmission and distribution systems — Wheeled, tracked or legged robots — Part 3‑31: Land cable tunnel inspection robot — General requirements. | TC 129 | 2025-12-18 | |
| 129/55/NP | PNW 129-55 ED1: Robotics for electricity generation, transmission and distribution systems — Wheeled, tracked or legged robots — Part 3‑21: Overhead transmission line inspection robot — General requirements | TC 129 | 2025-12-18 | |
| 111/855/NP | PNW 111-855 ED1: Digitalization of Carbon Footprint of Products (CFP) - Part 2: Format and Guidance for Exchanging CFP Data | TC 111 | 2025-12-18 | |
| 32A/368/NP | PNW 32A-368 ED1: Tutorial and application guidance for high-voltage fuses | TC 32/SC 32A | 2025-12-18 | |
| JTC1-SC41/543/NP | PNW JTC1-SC41-543 ED1: Digital twin – Process and guidance for digital twin model construction | ISO/IEC JTC 1/SC 41 | 2025-12-25 | |
| 2/2273/NP | PNW 2-2273 ED1: Part 27-7: Sealed winding test for insulation systems used in rotating electrical machines | TC 2 | 2026-01-01 | |
| 18A/510/NP | PNW 18A-510 ED1: Electrical installations in ships - Part xxx: Ship-to-shore connection cables of rated voltages up to and including 18/30 kV | TC 18/SC 18A | 2026-01-01 | |
| 47E/872/NP | PNW 47E-872 ED1: Semiconductor Devices - Part 16-XX: Microwave integrated circuits - Phase frequency detectors | TC 47/SC 47E | 2026-01-01 | |
| 91/2075/NP | PNW 91-2075 ED1: Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad | TC 91 | 2026-01-08 | |
| 91/2074/NP | PNW 91-2074 ED1: Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad | TC 91 | 2026-01-08 | |
| 91/2073/NP | PNW 91-2073 ED1: Thermography test method for printed circuit interconnection defects | TC 91 | 2026-01-08 | |
| 47/2969/NP | PNW 47-2969 ED1: Semiconductor devices - Neuromorphic devices - Part 5: Evaluation method of endurance and retention in memristor devices | TC 47 | 2026-01-08 | |
| 47/2968/NP | PNW 47-2968 ED1: Semiconductor devices-Neuromorphic devices - Part 6:Evaluation method of basic characteristics in one transistor one memristor (1T1M) arrays | TC 47 | 2026-01-08 | |
| 65C/1374/NP | PNW 65C-1374 ED1: Industrial networks – Profiles – Part 5-23: Installation of fieldbuses – Installation profiles for CPF 23 | TC 65/SC 65C | 2026-01-08 | |
| 65C/1373/NP | PNW 65C-1373 ED1: Industrial networks – Profiles – Part 2-23: Additional real-time fieldbus profiles based on ISO/IEC/IEEE 8802-3 - CPF 23 | TC 65/SC 65C | 2026-01-08 | |
| 65C/1372/NP | PNW 65C-1372 ED1: Industrial networks – Fieldbus specifications – Part 6-29: Application layer protocol specification – Type 29 elements | TC 65/SC 65C | 2026-01-08 | |
| 65C/1371/NP | PNW 65C-1371 ED1: Industrial networks – Fieldbus specifications – Part 5-29: Application layer service definition – Type 29 elements | TC 65/SC 65C | 2026-01-08 | |
| 65C/1370/NP | PNW 65C-1370 ED1: Industrial networks – Fieldbus specifications – Part 4-29: Data-link layer protocol specification – Type 29 elements | TC 65/SC 65C | 2026-01-08 |
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