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New work item proposal, NP
New work item proposal (NP) är termen som används inom IEC för nya förslag på standardiseringsprojekt.
Är du intresserad av att delta eller få ytterligare information om nya standardiseringsförslag, kontakta SEK kansli på senc@elstandard.se eller telefon 08-444 14 00.
Förslagen kan beställas kostnadsfritt från SEK Svensk Elstandard via formuläret nedan. Antalet kostnadsfria standardiseringsförslag är begränsat till tre. Vid beställning av fler än tre förslag och för utskick av pappersexemplar tas en avgift på 300 kr/förslag.
| Benämning IEC | Benämning CLC | Titel | SEK grupp | Deadline |
|---|---|---|---|---|
| 47/2835/NP | PNW 47-2835 ED1: Future IEC 63287-4: Semiconductor devices - Guidelines for reliability qualification plans - Part 4: Early failure assessment | TC 47 | 2024-04-25 | |
| 47D/962/NP | PNW TS 47D-962 ED1: Part model guideline for electronic-device packages - XML requirements | TC 47/SC 47D | 2024-04-25 | |
| 105/1032/NP | PNW 105-1032 ED1: Fuel cell technologies – Multi-generation of fuel cell systems for electricity, hydrogen generation and cooling – Performance test methods | TC 105 | 2024-04-25 | |
| 3/1652/NP | PNW 3-1652 ED1: Industrial systems, installations and equipment and industrial products -- Structuring principles and reference designation -- Part 20: Aircraft systems | TC 3 | 2024-05-02 | |
| 47D/963/NP | PNW 47D-963 ED1: Required Specification Of Package Substrates For Advanced Semiconductor Packaging - Part 1: Current-Induced Quality Test Method for Package Substrate | TC 47/SC 47D | 2024-05-02 | |
| JTC1-SC25/3215/NP | PNW JTC1-SC25-3215 ED1: Information technology - Home Electronic System (HES) - Communication messages for safe product operation | ISO/IEC JTC 1/SC 25 | 2024-05-02 | |
| 47/2840/NP | PNW 47-2840 ED1: IEC 63XXX-1 for SEMICONDUCTOR DEVICES - Reliability evaluation methods for vibration energy harvesters - Part 1 : Mechanical reliability under shock | TC 47 | 2024-05-09 | |
| 87/848/NP | PNW TS 87-848 ED1: Ultrasonics Field characterization Specification and measurement of field parameters at high pressure therapeutic levels in water | TC 87 | 2024-05-09 | |
| 116/742/NP | PNW 116-742 ED1: Electric motor-operated tools - Dust measurement procedure - Part 3-1: Particular requirements for transportable table saws | TC 116 | 2024-05-09 | |
| 100/4115/NP | PNW 100-4115 ED1: Portable multimedia equipment – Determination of battery duration – Part 3: Wearable powered loudspeaker equipment | TC 100/TA 19 | 2024-05-09 | |
| 100/4114/NP | PNW 100-4114 ED1: Audio, video, and related equipment — Determination of power consumption — Part 8: Small Network Equipment | TC 100/TA 19 | 2024-05-09 | |
| 87/849/NP | PNW TS 87-849 ED1: Ultrasonics Field characterization Measurement-based simulation in water and other media | TC 87 | 2024-05-09 | |
| 46F/667/NP | PNW 46F-667 ED1: Radio-frequency connectors – Part 74: Sectional specification for HN series RF coaxial connectors with screw coupling - Characteristic impedance 50 ohms | TC 46/SC 46F | 2024-05-09 | |
| 116/741/NP | PNW 116-741 ED1: Electric motor-operated tools - Dust measurement procedure - Part 2-19: Particular requirements for hand-held jointers | TC 116 | 2024-05-09 | |
| 45/970/NP | PNW 45-970 ED1: Linear accelerator - Electron linear accelerator for radiation processing - Part 1: General requirement and testing method | TC 45 | 2024-05-09 | |
| 105/1036/NP | PNW 105-1036 ED1: Unmanned aircraft systems -- General requirements and test methods for the attachable hydrogen cylinders of gaseous hydrogen fuel cell powered UAV | TC 105 | 2024-05-09 | |
| 105/1035/NP | PNW 105-1035 ED1: Unmanned aircraft systems - General requirements and test methods for the hydrogen fuel gas pipes of gaseous hydrogen fuel cell powered UAV | TC 105 | 2024-05-09 | |
| 47D/966/NP | PNW 47D-966 ED1: Model creation method using a datasheet of semiconductor device | TC 47/SC 47D | 2024-05-16 | |
| 47D/965/NP | PNW 47D-965 ED1: Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages | TC 47/SC 47D | 2024-05-16 | |
| 91/1940/NP | PNW 91-1940 ED1: Measurement method used in thermal design for electronics assemblies - Part 3: Temperature measurement method for miniaturized SMDs on circuit boards | TC 91 | 2024-05-16 | |
| 91/1939/NP | PNW 91-1939 ED1: Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized SMDs where the heat dissipation path to the board is dominant | TC 91 | 2024-05-16 | |
| 91/1938/NP | PNW 91-1938 ED1: Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites | TC 91 | 2024-05-16 | |
| 47D/964/NP | PNW 47D-964 ED1: 3D thermal simulation models of PBGA and FBGA packages for steady-state analysis | TC 47/SC 47D | 2024-05-16 | |
| SyCSmartEnergy/249/NP | PNW TS SYCSMARTENERGY-249 ED1: SRD: Reference Guidance for Energy Service Business Using Controllable Loads | SyC Smart Energy | 2024-05-23 | |
| 8B/209/NP | PNW TS 8B-209 ED1: Guidelines for the operation and control of microgrid clusters | TC 8/SC 8B | 2024-05-23 |
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